GIGABYTE AORUS NVMe Gen4 M.2 500GB PCI-Express 4.0 Interface High Performance Gaming, Full Body Copper Heat Spreader, Toshiba 3D NAND, DDR Cache Buffer, 5 Year Warranty SSD GP-ASM2NE6500GTTD
Weekly Top Sale GIGABYTE AORUS NVMe Gen4 M.2 500GB PCI-Express 4.0 Interface High Performance Gaming, Full Body Copper Heat Spreader, Toshiba 3D NAND, DDR Cache Buffer, 5 Year Warranty SSD GP-ASM2NE6500GTTD A quick review
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| Digital Storage Capacity | 500 GB |
| Hard Disk Interface | NVMe |
| Brand | Gigabyte |
| Specific Uses For Product | Gaming |
| Read Speed | 2500 Megabytes Per Second |
| Cache Size | 500 |
| Item Weight | 200 Grams |
| Item Dimensions LxWxH | 5.12 x 3.15 x 1.18 inches |
| Number of Items | 1 |
- Form Factor: M.2 2280
- Interface: PCI-Express 4.0 x4, NVMe 1.3
- Total Capacity: 500GB
- Sequential Read Speed : up to 5000 MB/s
- Sequential Write speed : up to 2500 MB/s
From the manufacturer
PCIe 4.0x4 Controller
PCIe 4.0x4 Controller, Phison PS5016-E16 controller, made by 28nm manufacturing technology. The advanced fabrication process ensures PS5016-E16 has enough compute power for ECC processing when adopting the latest 3D TLC NAND flash.
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NAND Flash Selected for High Quality and PerformanceToshiba BiCS4 NAND Flash optimizes circuitry and architecture. | Xtreme Storage PerformanceDelivers blazing speeds: up to 5,000 MB/s for sequential read, and up to 4,400MB/s sequential write. | Full Body Copper Thermal Solution for Outstanding PCIe 4.0 SSD PerformanceFull copper heatsinks have 69% higher heat transfer capacity compared to aluminum heatsinks . |
Explosion model
1. Efficiency Copper Heat Spreader
2. High Conductivity Thermal Pad
3. M.2 SSD
4. High Conductivity Thermal Pad
Efficient Copper Heat Spreader Design
Compared with a plated M.2 heat spreader, new efficient copper heat spreaders with 27 fins add more surface area which improve thermal transfer from heating sources to obtain thermal balance sooner. Moreover, Optimized fin array design does great heat exchange with any direction of air flow.
Product Description
Form Factor: M.2 2280 Interface: PCI-Express 4.0 x4, NVMe 1.3 Total Capacity: 500GB Sequential Read Speed : up to 5000 MB/s Sequential Write speed : up to 2500 MB/s Wear Leveling, Over-Provision technologies TRIM & S.M.A.R.
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